TV Backlight Bar Process

LED SMD Chip process

R & D Capability

Process ability

Plasma cleaning equipment

Item: Plasmax-800CH
Brand: 123
CO: Taiwan
Advantage: Use plasma cleaning machine to clean the oxide on the surface of the support and various residues, offer a quality and clean environment and frame for LED wafer chip fix and welding process
clean power: 50-600W

Wafer chip fix equipment

Item: AD50
Brand: ASM
CO: Hongkong
Machine Qty: 20 Pcs
Advantage: 1. Wafer chip X-Y axis accuracy +-1.5mil (38.1um), wafer chip rotation +-3 degree.
2. Equipment theoretical cycle time 50ms, two equipments working same time.

Wafer chip fix equipment

Item：AB380/383
Brand：ASM/KS
CO：Hongkong/USA
Machine Qty：35 Pcs
Advantage：1. Welding accuracy: 3um, welding zone: 56mmx70mm, X-Y axis resolution 50nm, Z axis resolution 200nm.
2. Image recognition accuracy: +-0.37um

Dispensing encapsulation equipment

Item：TAD1000
Brand：Musashi
CO：Japan
Machine Qty: 12 Pcs
Use quantitative dispensing encapsulation equipment to control the gum spitting time accuracy +-1ms, X-Y axis resolution +-0.02nm, Z axis resolution 0.01nm

Spectrometer

Item：HT-3900
Brand：Huateng
CO：Shenzhen
Machine qty: 18pcs
Advantage: Spectrometer use 256Bin, SLH8040 tester with integrating sphere measurement. Vf, Ir, Iv, λd, time of exposure 1ms, single crystal silicon test time < 40ms

Taping equipment

Item：HT-6900
Brand：Huateng
CO：Shenzhen
Machine qty: 20pcs
Advantage: Positive and negative light test, automatic steering function, use CCD screenage to identify led polarity direction, tape sealing time control within +-1 degree, tape speed: 26K/H-40K/H