Features

• Package Size:3.0*3.0*0.6 *2.4（φ）mm
• SMC materials have better heat resistant & Yellowing resistance &Anti-UV damage
• The symmetry pad have good heat dissipation
• Large Light angle、high ligh effiency、high brightness

IF（mA）	VF（V）	FLUX（lm）	CIE（X/Y）	备注
300	5.8-6.4	26	Blue-light	MP (Blue)
300	5.8-6.4	230	0.27/0.245	MP (YAG)
300	5.8-6.4	210	0.27/0.245	MP (KSF)

Process flow

Features

1. Low Rth

Category	Rth (typ）
Positive chip	11.5K/W
Flip chip	9.6K/W

2. Current density more uniformity

3. High brightness

Blue chip + QD Film方案：

LED P/N	Size:L * W * H & Material	Picture	Chip	mA/Test	V	lm	Max-mA	Color Coordinate
3030	3.0*3.0*0.6 Φ2.6 EMC		2P	450	2.9-3.5	44	600	X:0.27 Y:0.245
3030	3.0*3.0*0.55 Φ2.1 EMC		2P	450	2.9-3.5	42	600	X:0.27 Y:0.245

Blue chip + KSF + QD Film方案：

QD Spectrum

QD-TV Schematic diagram